Smaller is better when it comes to sterile device package design. The EtO package design is generally either a Tyvek lidded thermoform tray, a Tyvek-poly film pouch, or, for moisture- and ...

TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

In his San Francisco studio, package designer Primo Angeli explains that "there is a relationship between consumers and packages, a psychodrama, really." Indeed, packages are "silent salesmen" that ...

Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

The Future of Package Design Verification: Assembly Design Kits How to create a 2.5D and 3D-IC package with lower risk of failure.

Guest speaker Ruth Bush came to speak to the art class on Feb. 23. She is an artist, illustrator, and designer beginning out in Kutztown University. In the 1980s she was called by Hasbro to design ...