NEW YORK, United States, June 12, 2023 (GLOBE NEWSWIRE) -- Zion Market Research has published a new research report titled “Molded Underfill Material Market 2023 – 2030” in its research database.

Irvine, Calif. — Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications. The Hysol FP5110 material is said ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

Lord Corporation has announced the commercialisation of two new capillary flow, flip chip underfill encapsulants that are compatible with lead-free solder alloy processing conditions. As the demand ...

Designed to help secure CSP and BGA devices used in handhelds, CN-1531 underfill encapsulant has a 110°C glass transition temperature, allowing it to better withstand thermal cycling. The encapsulant ...

Master bond is leading the way in semiconductor packaging with a complete line of underfill, die attach, glob top and encapsulation compounds. These systems are designed for easy processing and ...

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, ...

CN-1736 reworkable underfill encapsulant is designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. CN-1736 reworkable underfill encapsulant is designed to underfill 0.4-mm pitch ...

The X2825 silica-filled reworkable board-level underfill encapsulant specifies a coefficient of thermal expansion (CTE) of 26 ppm/°C. The underfill enhances drop and shock test reliability and, ...