The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...

In early January 2026, Visteon showcased its most comprehensive CES exhibit to date in Las Vegas, unveiling production-ready cockpit electronics, AI computing solutions, advanced displays, and ...

Based on Qualcomm’s Dragonwing IQ-X platform, Advantech’s three edge AI compute boards deliver up to 45 TOPS of AI ...

ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.

For CES 2026, HP is debuting the EliteBoard G1a, a keyboard with a modular business Copilot+ PC inside. And this isn't just ...

New AI compute platform delivers up to 100 TOPS, multi-sensor fusion, and cloud-managed edge intelligence for robotics, ...

The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...

Thermal module maker Taiwan Microloops Corp. reported consolidated revenue of NT$317 million (US$10.2 million) in December ...

Voyant is leading the development of a new generation of FMCW LiDAR to address broad applications in the physical AI ...

AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the ...

Visteon will present two AI computing platforms addressing different automaker needs.