The world’s leading chip companies came to CES 2026 this week with some major announcements that will give channel partners a ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

Samsung Electro-Mechanics will operate its key production lines at full capacity in the second half of this year as demand ...

AMD (AMD) introduced the AMD Ryzen AI Embedded processors, a new portfolio of embedded x86 processors designed to power ...

AMD has introduced the AMD Ryzen AI Embedded processors, a new portfolio of embedded x86 processors designed to power AI-driven applications at the edge. From automotive digital cockpits and smart ...

News Highlights New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and ...

AMD unveils MI440X and Ryzen AI Embedded chips to challenge Nvidia in AI hardware, boosting edge and data-center performance.

TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January and is designed to support high ...

Abstract: With the increasing operating frequency and integration density of ball grid array (BGA) packaging in high-performance systems, radiation leakage, and signal interference from solder balls ...

So, you’re trying to get a handle on chip BGA technology? It’s pretty much everywhere in our gadgets these days, from phones to more serious equipment. Basically, it’s a way to pack a lot of ...